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Monolithic integration of silicon on insulator and gallium arsenide semiconductor technologies

机译:绝缘体上硅单片集成和砷化镓半导体技术

摘要

A semiconductor heterostructure includes separate, device quality regions of gallium arsenide and silicon layers on an insulating substrate such as aluminum oxide or silicon dioxide. The separate regions can be electrically isolated except for intended connections, permitting the fabrication of interrelated gallium arsenide and silicon semiconductor active devices on a single substrate. The device quality gallium arsenide is grown overlying the specially treated device quality silicon layer, by depositing a thin transition layer of gallium arsenide in low temperature growth, annealing it by solid phase epitaxy, and then depositing at a higher temperature a thicker epitaxial layer of gallium arsenide overlying the transition layer.
机译:半导体异质结构包括在诸如氧化铝或二氧化硅的绝缘衬底上的砷化镓和硅层的单独的器件质量区域。分开的区域除了预定的连接之外可以被电隔离,从而允许在单个基板上制造相互关联的砷化镓和硅半导体有源器件。器件品质的砷化镓是在经过特殊处理的器件品质的硅层上生长的,方法是在低温生长过程中沉积一层薄的砷化镓过渡层,通过固相外延对其进行退火,然后在较高的温度下沉积较厚的镓外延层砷化物覆盖过渡层。

著录项

  • 公开/公告号US5081062A

    专利类型

  • 公开/公告日1992-01-14

    原文格式PDF

  • 申请/专利权人 VASUDEV;PRAHALAD;DHAENENS;IRNEE J.;

    申请/专利号US19890366973

  • 发明设计人 PRAHALAD VASUDEV;IRNEE J. DHAENENS;

    申请日1989-06-14

  • 分类号H01L21/20;H01L21/203;H01L29/161;C21D1/10;

  • 国家 US

  • 入库时间 2022-08-22 05:23:27

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