首页>
外国专利>
ELECTROLESS COPPER PLATING METHOD AND EQUIPMENT THEREFOR
ELECTROLESS COPPER PLATING METHOD AND EQUIPMENT THEREFOR
展开▼
机译:化学镀铜方法及其设备
展开▼
页面导航
摘要
著录项
相似文献
摘要
An electroless copper plating process for producing fine patterned wiring boards is improved by supplying very fine oxygen-containing gas bubbles through a porous alkali-resistant resin gas dispersing tube. An electroless copper plating apparatus having such a gas dispersing tube is also provided.
展开▼