PURPOSE: To automatically set the temperature conditions in a reflow device based on the manufacture conditions in a controller for the reflow device melting a solder for a printed board. ;CONSTITUTION: A substrate information 1 is an information such as the material, thickness, size of the printed board. A database 2 is a preliminarily registered initially set value based on the substrate information 1. A temperature detecting body 3 is a thermocouple attached to the printed board signals of the board information 1, database 2 and temperature detecting body 3 are fetched to a calculating means 4 and the temperature conditions for the reflow device 5 is automatically set.;COPYRIGHT: (C)1993,JPO&Japio
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