ELECTROLESS NI-P PLATING ELECTRODE FILM

摘要

PURPOSE: To increase the adhesive strength and to improve reliability by forming an electroless Ni-P plating electrode film having a specified content of P on a ceramic element assembly and heat-treating the film at a specified temp. ;CONSTITUTION: A ceramic element assembly such as a ceramic capacitor and a ceramic semiconductor is electroless-plated to form an Ni-P plating electrode film contg. 6-9wt.% P, and then the film is heat-treated at 200-500°C. The adhesive strength of the electrode film is surely increased without being affected by the composition, etc., of the element assembly by adjusting the P content of the plating film.;COPYRIGHT: (C)1993,JPO&Japio