首页>
外国专利>
METHOD FOR CONTROLLING WAVE SOLDER WAVEFORM SURFACE, CONTROLLING JIG AND SOLDERING DEVICE
METHOD FOR CONTROLLING WAVE SOLDER WAVEFORM SURFACE, CONTROLLING JIG AND SOLDERING DEVICE
展开▼
机译:焊锡波表面的控制方法,治具及焊锡装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: To stabilize the solded state of a printed borad and obtain a high yield by holding plural guide bolts arranged at a specified interval in the advancing direction of a printed board respectively independently in the vertical direction so that they can move finely. ;CONSTITUTION: In a control jig 30, three wave solder waveform surface heights of each guide bolt 8 obtained by preparatory experiments according to a printed board 40 to be solded are set respectively specially and fixed by nuts 9. Then, the control jig 30 of the wave solder waveform surface where the guide bolts 8 are set specifically is arranged on a specified position of the upper part of the wave soldering device 10. Then, a specified number of rotation is set to the driving motor of a solder circulating device, in that case, the best state is confirmed, the preliminary control and the preparation are completed so that the wave solder waveform surface 11 comes in contact with the tips of the respective guide bolts 8 set at three places. The printed board 40 is carried by a conveyor in sequence in a state that the wave solder waveform surface 11 is set to the best waveform.;COPYRIGHT: (C)1993,JPO&Japio
展开▼