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RESIN BOND GRINDING WHEEL FOR METAL PRECISION GRINDING
RESIN BOND GRINDING WHEEL FOR METAL PRECISION GRINDING
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机译:用于金属精密磨削的树脂粘合砂轮
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摘要
PURPOSE: To improve surface roughness by containing the specified volume% of abrasive grains of carbonate in a resin bond grinding wheel for a semi- conductive wafer and the like. ;CONSTITUTION: A resin bond grinding wheel for metal precision grinding includes at least 30 volume% of abrasive grains of one or more kinds of carbonate, for example, Li2CO3, in alkaline metal or alkaline earth metal. The average diameter of an abrasive grain of carbonate is set to 50μm or less. As the resin, phenol, epoxide, polyimide, polystyrene, or polyethylene is used.;COPYRIGHT: (C)1993,JPO&Japio
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机译:目的:通过在用于半导体晶片等的树脂粘结砂轮中包含指定体积%的碳酸盐磨粒来改善表面粗糙度。 ;组成:用于金属精密磨削的树脂粘结砂轮至少包含30%(体积)的一种或多种碳酸盐,例如Li 2 Sub> CO 3 Sub> ,在碱金属或碱土金属中。碳酸盐磨粒的平均直径设定为50μm或更小。作为树脂,可使用苯酚,环氧化物,聚酰亚胺,聚苯乙烯或聚乙烯。;版权所有:(C)1993,JPO&Japio
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