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REACTIVE GAS FOR PLASMA ASSISTED CHEMICAL ETCHING AND METHODS FOR STABLE PLASMA ETCHING OF SUBSTRATES OVER EDGES
REACTIVE GAS FOR PLASMA ASSISTED CHEMICAL ETCHING AND METHODS FOR STABLE PLASMA ETCHING OF SUBSTRATES OVER EDGES
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机译:等离子体辅助化学刻蚀的活性气体和边缘上等离子稳定刻蚀的方法
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摘要
A small percentage of an electronegative gas is included in a gas mixture which is fed into a plasma region of a plasma assisted chemical etching apparatus so as to suppress arc-like discharges at surface discontinuities of a substrate which is receiving etching treatment to shape the surface thereof.
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