;The physical design of the chip comprises the following main steps :power assignment (S7), timing analysis (S8), floor planning (S9), placement (S10) and wiring (S11) steps that make use of the data generated during the previous steps to ensure an optimal placement and wiring of the books; and,a mask data generation step (S13) that generates data (D14), from which mask patterns can be produced onto the integrated circuit chips."/>
公开/公告号EP0539641A1
专利类型
公开/公告日1993-05-05
原文格式PDF
申请/专利号EP19910480167
申请日1991-10-31
分类号G06F15/60;
国家 EP
入库时间 2022-08-22 05:05:39