A process for the deposition of an insulating layer on a conductive layer of the multi-layer network of a printed circuit is connected to conductor tracks of high density and a resulting printed circuit board.

摘要

The formation of an insulating layer which is coplanar with the upper surface of the pillars 21 of the conductive layer 16a, 16b is made by engraving of an insulating layer 26 formed of several successive layers 22, 23, 24, 25 so as to obtain a surface with steps of a maximum height s4 is substantially equal to or less than a desired value corresponding to the desired degree of planeness of the insulating layer.