High-density multi-layer printed circuit board used in the inner layer circuit for the copper foil and high-density multi-layer printed circuit inner layer copper foil

摘要

A copper foil for a high density multilayer printed circuit inner layer having a coiled coating on the side of a glossy surface of an electrolytic copper foil, and forming a minute electrodeposited projection having a needle like or cob shape and forming a minute and uniform cobuting process, and a glossy surface side of the copper foil A high density multilayer printed circuit board is characterized in that an inner layer circuit is formed by bonding to the inner layer substrate.