Process for preparing an assembly of an article and a soluble polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature

摘要

An assembly of an article and a polyimide is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A soluble polyimide resin solution having a low coefficient of thermal expansion (CTE) was prepared by dissolving the polyimide in solvent and adding a metal ion-containing additive to the solution. Examples of this additive are: Ho(OOCCH.sub.3). sub.3, Er(NPPA).sub.3, TmCl.sub.3, and Er(C.sub.5 H. sub.7 O.sub.2).sub.3. The soluble polyimide resin is combined with the article to form the assembly.