Process for preparing an assembly of an article and a polymide which resists dimensional change, delamination and debonding when exposed to changes in temperature

摘要

An assembly of an article and a polyimide composition is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A polyamic acid solution which yields a polyimide having a low coefficient of thermal expansion (CTE) was prepared. Equimolar quantities of an aromatic diamine and an aromatic dianhydride were reacted in a solvent medium to form a polyamic acid solution. A metal ion-containing additive was added to the solution. Examples of this additive are: TbCl. sub.3, DyCl.sub.3, ErCl.sub.3, TmCl.sub.3, Al(C.sub.5 H.sub.7 O.sub.2). sub.3, and Er.sub.2 S. sub.3. The polyamic acid solution was imidized and is combined with the article to form the assembly.