首页> 外国专利> APPLICATION OF OUTSIDE PAINT AND CONDUCTIVE PASTE TO SQUARE CHIP COMPONENT

APPLICATION OF OUTSIDE PAINT AND CONDUCTIVE PASTE TO SQUARE CHIP COMPONENT

机译:外部涂料和导电涂料在方形芯片中的应用

摘要

PURPOSE: To apply efficiently each of a conductive paste and a packaging paint on both end surfaces and other surfaces of individual square chip components as well as to make the process of the application suitable for automation. ;CONSTITUTION: While cut grooves 25 and 28 for splitting a component sheet 21 into individual square chip components are formed in a state that the component sheet 21 in before it is split into the individual chip parts is held on a holding sheet 23, an outside paint 26 and a conductive paste 29 are respectively applied and filled in the grooves 25 and 28, whereby the paste 29 and the paint 26 are respectively applied on the end surfaces and other surfaces of the square chip components to be split individually. As this paste 29 and the paint 26 are applied between the groove surfaces of the respective cut grooves 28 and 25, the paste 29 and the paint 26 adhere on the end surfaces of the individual square chip components and the chip components are split by cutting the central parts of the paste 29 and the paint 26.;COPYRIGHT: (C)1994,JPO&Japio
机译:目的:有效地在单个方形芯片组件的两个端面和其他表面上分别涂覆导电胶和包装涂料,并使应用过程适合自动化。 ;构成:在将部件片21分割成各个芯片部之前的状态下,形成用于将部件片21分割成各个方形芯片部件的切槽25、28,将其保持在保持片23的外侧。分别在槽25和28中涂覆并填充涂料26和导电糊剂29,从而将糊剂29和涂料26分别涂覆在方形芯片组件的端面和其他表面上,以分别分开。当在各个切槽28和25的槽表面之间施加该糊剂29和涂料26时,糊剂29和涂料26粘附在各个方形芯片部件的端面上,并且通过切割该芯片部件而使芯片部件分裂。膏体29和涂料26的中央部分。;版权所有:(C)1994,日本特许厅和日本料理

著录项

  • 公开/公告号JPH06204271A

    专利类型

  • 公开/公告日1994-07-22

    原文格式PDF

  • 申请/专利权人 TAIYO YUDEN CO LTD;

    申请/专利号JP19920361419

  • 申请日1992-12-29

  • 分类号H01L21/56;B05D7/00;C09D5/24;H01G1/14;H01G13/00;H01L23/29;H01L23/31;

  • 国家 JP

  • 入库时间 2022-08-22 04:51:19

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号