MANUFACTURING METHOD OF ANISOTROPIC CONDUCTIVE PASTE CAPABLE OF MAKING HIGH SPEED CHIP BONDING PROCESS POSSIBLE WITH IMPROVING THE WEAKNESS OF 1-COMPONENT TYPE ANISOTROPIC CONDUCTIVE PASTE POSSIBLE, AND MANUFACTURING METHOD OF AN ELECTRIC CONNECTING STRUCTURE BY USING INEXPENSIVE ANISOTROPIC CONDUCTIVE PASTE

摘要

PURPOSE: A manufacturing method of anisotropic conductive paste is provided to reduce the time for chip bonding in relation to a solder adhesion, and to reduce the cost of anisotropic conductive paste in relation to 1-component type anisotropic conductive paste.;CONSTITUTION: A manufacturing method of an anisotropic conductive paste comprises: a step of coating hardening catalyst agent on a substrate with an electrode; a step of spreading anisotropic conductive paste without a hardening catalyst on the substrate; a step of bonding chips with electrodes on a plane which is spread by the anisotropic conductive paste, and thermocompression bonding processing.;COPYRIGHT KIPO 2012