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High Tg and fast curing epoxy-based anisotropic conductive paste for electronic packaging

机译：高TG和快速固化环氧基各向异性导电浆料用于电子包装

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Waralee Keeratitham; Anongnat Somwangthanaroj;
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1. Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications [J] . LIQIANG CAO, SHIMING LI, ZONGHE LAI, Journal of Electronic Materials . 2005,第11期

机译：用于微电子包装应用的各向异性导电胶的配方和表征
2. Silver nanoparticles decorated alpha-alumina as a hybrid filler to fabricate epoxy-based thermal conductive hybrid composite for electronics packaging application [J] . Nayak Sagar Kumar, Mohanty Debabrata Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology . 2020,第13a16期

机译：银纳米粒子装饰α-氧化铝作为杂种填料，用于制造基于环氧的导热混合复合材料，用于电子包装应用
3. Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives [J] . Mary Teo Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology . 2008,第8a9期

机译：表征快速固化各向异性导电和非导电胶粘剂的新技术
4. High T_g and Fast Curing Epoxy-based Anisotropic Conductive Paste for Electronic Packaging [C] . Waralee Keeratitham, Anongnat Somwangthanaroj International Conference of the Polymer Processing Society . 2016

机译：高T_G和快速固化的基于环氧的各向异性导电浆料用于电子包装
5. Electrical contact resistance of anisotropic conductive adhesive assemblies in microelectronics packaging. [D] . Chin, Melida. 2005

机译：微电子封装中的各向异性导电粘合剂组件的电接触电阻。
6. Effects of CO2 Curing on Alkali-Activated Slag Paste Cured in Different Curing Conditions [O] . Yubin Jun, Seong Ho Han, Tae Yong Shin, 2019

机译：CO2固化对不同固化条件下碱活化矿渣糊的影响
7. High-Density Electronic Packaging Technology using Anisotropic Conductive Adhesives [O] . Jin-Woon Lee, Seong-Hyuk Lee, Jong-Min Kim 2008

机译：使用各向异性导电粘合剂的高密度电子包装技术

High Tg and fast curing epoxy-based anisotropic conductive paste for electronic packaging

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