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DESIGN METHOD OF MANUFACTURING PROCESS OF SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGN DEVICE FOR THE MANUFACTURING PROCESS AND CONTROLLER FOR SEMICONDUCTOR INTEGRATED-CIRCUIT MANUFACTURING
DESIGN METHOD OF MANUFACTURING PROCESS OF SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGN DEVICE FOR THE MANUFACTURING PROCESS AND CONTROLLER FOR SEMICONDUCTOR INTEGRATED-CIRCUIT MANUFACTURING
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机译:半导体集成电路制造过程的设计方法,制造过程的设计装置以及半导体集成电路制造的控制器
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摘要
PURPOSE: To provide the design method of the manufacturing process of a semiconduc tor integrated circuit capable of determining a manufacturing parameter in considera tion of all manufacturing processes of the semiconductor integrated circuit, a design device for the manufacturing process of the semiconductor integrated circuit using the design method of the manufacturing process and a controller for a semiconductor integrated-circuit manufacturing device. ;CONSTITUTION: A sectional-shape preparation process S2 preparing the sectional shape of a semiconductor integrated circuit on the basis of a manufacturing parameter required for manufacturing the semiconductor integrated circuit, correction processes S4, 5, 6 detecting the structural abnormal position of the semiconductor integrated circuit by the prepared sectional shape and correcting the structural abnormal position to normal structure, and correction manufacturing-parameter leading-out processes S7, 8 leading out a novel manufacturing parameter corresponding to normal structure so that the semiconductor integrated circuit manufactured has normal structure after correction are provided.;COPYRIGHT: (C)1994,JPO&Japio
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