首页> 外国专利> DESIGN METHOD OF MANUFACTURING PROCESS OF SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGN DEVICE FOR THE MANUFACTURING PROCESS AND CONTROLLER FOR SEMICONDUCTOR INTEGRATED-CIRCUIT MANUFACTURING

DESIGN METHOD OF MANUFACTURING PROCESS OF SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGN DEVICE FOR THE MANUFACTURING PROCESS AND CONTROLLER FOR SEMICONDUCTOR INTEGRATED-CIRCUIT MANUFACTURING

机译:半导体集成电路制造过程的设计方法,制造过程的设计装置以及半导体集成电路制造的控制器

摘要

PURPOSE: To provide the design method of the manufacturing process of a semiconduc tor integrated circuit capable of determining a manufacturing parameter in considera tion of all manufacturing processes of the semiconductor integrated circuit, a design device for the manufacturing process of the semiconductor integrated circuit using the design method of the manufacturing process and a controller for a semiconductor integrated-circuit manufacturing device. ;CONSTITUTION: A sectional-shape preparation process S2 preparing the sectional shape of a semiconductor integrated circuit on the basis of a manufacturing parameter required for manufacturing the semiconductor integrated circuit, correction processes S4, 5, 6 detecting the structural abnormal position of the semiconductor integrated circuit by the prepared sectional shape and correcting the structural abnormal position to normal structure, and correction manufacturing-parameter leading-out processes S7, 8 leading out a novel manufacturing parameter corresponding to normal structure so that the semiconductor integrated circuit manufactured has normal structure after correction are provided.;COPYRIGHT: (C)1994,JPO&Japio
机译:用途:为了提供一种半导体集成电路的制造工艺的设计方法,该方法能够考虑到半导体集成电路的所有制造工艺来确定制造参数,一种使用该半导体集成电路的制造工艺的设计装置制造过程的设计方法和用于半导体集成电路制造装置的控制器。 ;组成:截面形状准备过程S2,基于制造半导体集成电路所需的制造参数来准备半导体集成电路的截面形状;校正过程S4、5、6,用于检测半导体集成电路的结构异常位置通过准备截面形状并将结构异常位置校正为正常结构的电路,以及校正制造参数导出过程S7、8,导出对应于正常结构的新颖的制造参数,以使得所制造的半导体集成电路在校正后具有正常结构提供。;版权:(C)1994,JPO&Japio

著录项

  • 公开/公告号JPH06151814A

    专利类型

  • 公开/公告日1994-05-31

    原文格式PDF

  • 申请/专利权人 RICOH CO LTD;

    申请/专利号JP19920252660

  • 发明设计人 AGARI HIDEKI;

    申请日1992-09-22

  • 分类号H01L29/00;G06F15/60;

  • 国家 JP

  • 入库时间 2022-08-22 04:49:49

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