HIGH-HARDNESS ELECTROLESS NICKEL-BORON PLATING LIQUID AND PLATING METHOD USING THIS LIQUID

摘要

PURPOSE: To obtain a high-hardness plating film without subjecting the film to a high-temp. treatment by allowing borate ions and ammonium ions to exist into an electroless nickel-boron plating liquid. ;CONSTITUTION: This electroless Ni-B plating liquid is prepd. by incorporating nickel ions, boric acid-based reducing agent, borate ions and ammonium ions into the liquid. The high-hardness film is obtd. by using this plating liquid without subjecting the film to the high-temp. treatment and, therefore, the deformation of a blank material having low heat resistance is prevented. Plating is executable with precise dimensional accuracy even with the blank material with which the deformation, etc., do not arise. In addition, the film is made smooth and is improved in the appearance by adding amines, such as alkanol amine, to the above-mentioned plating liquid.;COPYRIGHT: (C)1993,JPO&Japio