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METHOD AND APPARATUS FOR HEAT-TREATING SEMICONDUCTOR, AND METHOD OF EVALUATING SEMICONDUCTOR

机译:热处理半导体的方法和装置,以及评估半导体的方法

摘要

PURPOSE: To conduct quality inspection in a highly precise manner by controlling the atmosphere in the circumference of a semiconductor in the specific vapor pressure. ;CONSTITUTION: When a semiconductor substrate is taken out from the heat treatment part of a heat treatment device, a slight amount of moisture is added to the atmosphere around the semiconductor substrate, and the atmosphere surrounding the semiconductor is controlled to the vapor pressure of 1 to 5×103 Pa. The above-mentioned addition of moisture can be accomplished by adjusting the flow rate of gas of a dry gas line flow meter 1 and a moisture adding line flow meter 2, by conducting temperature adjustment of a constant- temperature vessel 3, and by mixing the gas of the above-mentioned two lines. As a result, the contamination, defect and the like in the semiconductor and a semiconductor manufacturing device can be evaluated accurately, and a highly precise quality inspection can be conducted on the semiconductor substrate and the semiconductor manufacturing device.;COPYRIGHT: (C)1994,JPO&Japio
机译:目的:通过以特定的蒸气压控制半导体周围的气氛,以高精度进行质量检查。 ;组成:从热处理设备的热处理部分中取出半导体衬底时,半导体衬底周围的气氛中会加入少量水分,并且将半导体周围的气氛控制为1的蒸气压。至5×10 3 Pa。上述水分的添加可通过调节干气管线流量计1和水分添加管线流量计2的气体流量,通过进行调节恒温容器3的温度,并混合上述两条管线的气体。结果,可以准确地评估半导体和半导体制造装置中的污染,缺陷等,并且可以对半导体衬底和半导体制造装置进行高精度的质量检查。;版权所有:(C)1994 ,JPO&Japio

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