首页> 外国专利> EXTRUDABLE BONDING RESIN COMPOSITION COMPRISING AT LEAST TWO DIFFERENT ETHYLENE COPOLYMERS HAVING AT LEAST ONE COMONOMER IN COMMON, AND A TACKIFYING RESIN; LAMINATES HAVING THESE COMPOSITIONS AS BONDING AGENT

EXTRUDABLE BONDING RESIN COMPOSITION COMPRISING AT LEAST TWO DIFFERENT ETHYLENE COPOLYMERS HAVING AT LEAST ONE COMONOMER IN COMMON, AND A TACKIFYING RESIN; LAMINATES HAVING THESE COMPOSITIONS AS BONDING AGENT

机译:包含至少两种共聚的至少一种共聚单体的至少两种不同的乙烯共聚物的可挤出键合树脂组合物;具有作为粘合剂的这些成分的层压板

摘要

An extrudable bonding resin composition of (a) 65 to 99 percent of an ethylene copolymer portion of a copolymer of ethylene and 20 to 50 percent comonomer of acids, esters, and the like, and grafted sidechains of comonomer units selected from carboxylic acid, anhydride, salt, or half ester functionality, and optionally a compatible non-grafted ethylene copolymer, and (b) 1 to 35 percent by weight of a tackifying resin exhibits good adhesion properties without the need for a primer.
机译:(a)乙烯与20-50%的酸,酯等的共聚单体的共聚物的乙烯共聚物部分的65-99%的乙烯共聚物部分和选自羧酸,酸酐的共聚单体单元的接枝侧链的可挤出粘合树脂组合物,盐或半酯官能团,以及任选的相容性非接枝乙烯共聚物,以及(b)1至35%的增粘树脂表现出良好的粘合性能,而无需底漆。

著录项

  • 公开/公告号NZ238657A

    专利类型

  • 公开/公告日1994-08-26

    原文格式PDF

  • 申请/专利权人 E I DU PONT DE NEMOURS & CO;

    申请/专利号NZ19910238657

  • 发明设计人 LEE I-HWA;

    申请日1991-06-21

  • 分类号C09J123/04;C09J151/06;B32B27/04;

  • 国家 NZ

  • 入库时间 2022-08-22 04:44:51

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