DIE MOUNTING WITH UNIAXIAL CONDUCTIVE ADHESIVE

摘要

Is produced an electronic component (10) by means of a method for coupling a circuit element (18) to a substrate (12). Said circuit element has a discontinuous layer of passivation (20) with grooves, so as to make electrical contact. is coupled to an element mounting surface (14) of a substrate having conductive paths (16). Is applied over said adhesive conductive paths (26) comprising a resin in which are suspended the conductive metal particles and remote from each other. Reducing the distance between the electrical contacts (22) and the conductive paths, so as to provide electrical conduction through the adhesive, while maintaining the non-conductivity between the conductive paths. A portion of said conductive paths may comprise raised contact surfaces or protrusion (24). Is mounted the element on the adhesive while aligning the contacts vertically above preselected contact surfaces and forming a protrusion. pressure is applied in order to concentrate the conductive metal particles between the contacts and the conductive paths, thereby to realize the conduction.