TRANSFER MATERIALS FOR DRAWN LEADERS AND PREPARED DRAWN LEADERS FOR USE OF THIS TRANSFER MATERIAL AND MANUFACTURING PROCEDURE.

摘要

Transfer material for the production of printed circuit boards has the structure shown in the Figure, where 1 is the transfer base sheet; 2 is the circuit pattern part; 3 and 8 are conductive bridges; 4a, 4b are conductive layers and 5a, 5b are insulating layers. The outer circuit pattern layers (4b, 5b) are composed of (a) a thermoplastic resin in which thermal deformation begins to develop at 120-300 deg. C; (b) a thermosetting resin having reactive groups which remain intact during setting; or (c) a resin which is both heat and UV curable. By contacting with a moulding resin which forms the circuit base plate, under suitable pressure and temperature, the circuit pattern can be transferred to the base plate either simultaneously with or just after the base plate formation.