Producing adjustment structure for PCB - providing structured window in solder stop mark overlying metal zone applied to circuit board surface

摘要

The adjustment structure is formed on the surface of the circuit board via an applied metallic zone (6) which is overlaid by a structured solder stop mask having an adjustment window (7) lying within the metallic zone. Pref. the adjustment window is in the shape of a cross, the underlying metallic zone being provided by a large surface area copper layer. USE - For preventing offset between circuit board metal contact zones (2) and openings (3) in applied solder stop foil.