Improving micro-chip power density - applying substance with high electrical insulation and dielectric constant to chip structure

摘要

Pref., the substance applied to the chip is a foil in which the molecules have an anisotropy in a given direction, the insulation being raised to between 10power9 and 10power11 Ohm-cm, with a dielectric constant of between 64 and 80. The substance pref. comprises a mixture of ethylene and propylene carbonates. ADVANTAGE - Allows higher electron loading.