首页> 外国专利> Capacitor in an integrated functional block or in an integrated circuit with a large capacitance; a method for the production of the capacitor; and use of the capacitor in the form of an integrated decoupling capacitor

Capacitor in an integrated functional block or in an integrated circuit with a large capacitance; a method for the production of the capacitor; and use of the capacitor in the form of an integrated decoupling capacitor

机译:集成功能块或大电容集成电路中的电容器;电容器的制造方法;集成去耦电容器形式的电容器的使用和使用

摘要

the present invention relates to a method to facilitate the manufacture of a mos kondensatorstruktur in funktionsblocks or integrated circuits, without additional siliziumoberflu00e4che or any additional process step in the production of the material n a standard mos or bicmos technique required.$a of each block or any cell with entkopplungskondensatoren under the wide metal supply lines without a separate siliziumoberflu00e4che fitted to need. these "buried" under each broad leiterpfad capacitors are provided in or on a chip. $a fig.1 shows a halbleitersubstrat of type p - or n - by the line (10) limited kondensatorstruktur (1) in the form of an h, the surface (12) is plated.in the schenkelu00f6ffnungen is both a metallized surface (15, 16) of a polysiliziumschicht (14) inserted in the cross under a high (12) supporting polysiliziumschicht, isolated by an oxide layer, smoothly.querverbindungslu00f6cher lead to conductive islands of type p + or n +, in the surface of the substrate are implanted and other metallisierungsschichten on other levels. $a capacity of the capacitor is 10 - 12 times larger than the one in the state the technique produced structure.
机译:本发明涉及一种便于在功能块或集成电路中制造mos kondensatorstruktur的方法,而无需在标准mos或bicos技术的材料生产中进行额外的硅化或任何附加的工艺步骤。或任何在宽阔的金属供应线下带有entkopplungskondensatoren的单元,而无需安装单独的硅管。每个“宽” leiterpfad电容器下的这些“埋入”都提供在芯片内或芯片上。 $ a图1通过线(10)的h形式的有限的kondensatorstruktur(1)线显示了p-或n-型的半透明底物,表面(12)镀了镀锌层。schenkel u00f6ffnungen都是金属化的多晶硅(14)的表面(15、16)插入十字架下方的高(12)支撑多晶硅(由氧化物层隔离)的下方.querverbindungsl u00f6cher导致p +或n +类型的导电岛。植入衬底的表面,并在其他水平上植入其他金属。电容器的容量$ a是该技术生产结构中电容器容量的10到12倍。

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