Interconnection device vertical -ala-glu-gly-thr-phe-thr-ser-asp-val-ser-ser-tyr-leu-glu-gly-gln-ala-ala-lys-glu-phe-ile-ala-trp-leu-val-lys-gly-gly-och3 integrated circuits and its method of manufacturing

摘要

The subject of the present invention is a vertical interconnection device for semiconductor chips each carrying an integrated circuit. According to the invention, the chips are stacked and fastened together; their connection tags are connected to the lateral walls of the stack and interconnected using conductors deposited on the lateral walls of the stack. IMAGE