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Method and apparatus for laser soldering of microelectronic lead- pad assemblies on ceramic substrates
Method and apparatus for laser soldering of microelectronic lead- pad assemblies on ceramic substrates
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机译:在陶瓷基板上激光焊接微电子引线垫组件的方法和设备
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摘要
This invention relates to an method and apparatus for soldering microelectronic lead connections to pads on a ceramic substrate with the aid of a fiber based Neodymium:yttrium-aluminum-garnet (Nd:YAG) laser. Such structures of this type, generally, provide a means of delivering sufficient localized heating to the ceramic substrate to reflow solder plate or melt solder cream (paste) within the lead connection without any substrate preheating.
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