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Process for producing a buried stripe semiconductor laser using dry etching for forming said stripe and laser obtained by this process
Process for producing a buried stripe semiconductor laser using dry etching for forming said stripe and laser obtained by this process
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机译:使用干蚀刻形成所述条的埋入式条纹半导体激光器的方法以及通过该方法获得的激光器
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摘要
A process is disclosed for producing a buried stripe semiconductor laser using dry etching. According to the present invention, a heterostructure is formed by a first epitaxy, during which, on a substrate is deposited a confinement layer having a first doping type, an active layer and a protection layer. The protection layer and the active layer are etched by a reactive ion beam etching method using a gaseous mixture of argon, methane and hydrogen and this takes place down to the confinement layer, so as to form a stripe from the active layer. The stripe is buried by a second epitaxy in a semiconductor layer having a second type of doping which is the opposite of the first. Particular utility is found in the area of optical telecommunications, although other utilities are contemplated.
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