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Process for producing a buried stripe semiconductor laser using dry etching for forming said stripe and laser obtained by this process

机译:使用干蚀刻形成所述条的埋入式条纹半导体激光器的方法以及通过该方法获得的激光器

摘要

A process is disclosed for producing a buried stripe semiconductor laser using dry etching. According to the present invention, a heterostructure is formed by a first epitaxy, during which, on a substrate is deposited a confinement layer having a first doping type, an active layer and a protection layer. The protection layer and the active layer are etched by a reactive ion beam etching method using a gaseous mixture of argon, methane and hydrogen and this takes place down to the confinement layer, so as to form a stripe from the active layer. The stripe is buried by a second epitaxy in a semiconductor layer having a second type of doping which is the opposite of the first. Particular utility is found in the area of optical telecommunications, although other utilities are contemplated.
机译:公开了一种使用干法蚀刻生产掩埋条纹半导体激光器的方法。根据本发明,通过第一外延形成异质结构,在此期间,在基板上沉积具有第一掺杂类型的限制层,有源层和保护层。通过使用氩气,甲烷和氢气的气态混合物的反应性离子束蚀刻方法蚀刻保护层和活性层,并且该保护层和活性层向下发生到限制层,从而从活性层形成条纹。通过第二外延将条带掩埋在具有第二类型掺杂的半导体层中,该第二类型掺杂与第一类型相反。尽管考虑了其他实用程序,但是在光通信领域中发现了特殊的实用程序。

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