VERTICAL IC CHIP STACK HAVING DISCRETE CHIP CARRIERS FORMED FROM DIELECTRIC TAPE

摘要

PURPOSE: To provide a three-dimensional IC chip stack which enables saving of an occupied area, processes advantages of an LTCC structure, enables use of standard IC chips and enables replacement of a defective chip alone, without discarding other chips of the stack. ;CONSTITUTION: Each of chip carriers, 6, 8 is constructed of a plurality of jointed dielectric tape layers 14, 16,...24 and equipped with a floor 10 for the carrier and a hollow 30, formed of an opening of an upper tape layer 12. IC chips 2, 4 are disposed in this hollow 30, accordingly, and a horizontal wiring line provided on the floor along one or more tape layers, a vertical wiring line 28 passing through the uppermost tape layer of the floor and extending to the horizontal wiring line, an electric connector 26 for connecting the IC chips 2, 4 to the vertical wiring line 28, an inter-carrier mutual connection part 34 connecting the vertical wiring lines for adjacent carriers and a stack connection part 32 connected to each inter-carrier mutual connection part 34, so as to make external connection for a stack, are provided.;COPYRIGHT: (C)1995,JPO