Manufacturing method of organicity composition suspensoid of epoxy resin hardened material, manufacturing method and suspensoid null of

摘要

PURPOSE: To simply obtain a suspension useful for a matting agent, abrasive, etc., because of high heat resistance and high roundness and a narrow particle size distribution by reacting an epoxy resin with a curing agent in the presence of a specific oligomer in an organic solvent. ;CONSTITUTION: (A) An epoxy resin, especially preferably a phenol etherbased epoxy resin is reacted with (B) a curing agent, especially preferably an aliphatic polyamine such as ethylenediamine in the presence of (C) an oligomer which is a blocked material of a carboxylic acid modified polyolefin oligomer and/or an oligomer prepared by copolymerizing an olefin with a vinyl monomer such as vinylcarboxylic acid ester or vinylcarboxylic acid amide and has preferably 1,000-25,000 number-average molecular weight in (D) an organic solvent which dissolves or disperse the component A to the component C but slightly dissolves or does not dissolve a formed cured material of the epoxy resin to give the objective suspension. The weight ratio of the component A to the component C is preferably (A+B):C=100:(0.5-10).;COPYRIGHT: (C)1994,JPO