The pressure sensitivity resistant change die conductive coating film formation Characteristic constituent null which it uses as the switching device

摘要

PURPOSE:To obtain a composition, which shows electric resistance substantially lower than that of the case where electric resistance is compressed, and to obtain the composition which gives a pressure-sensitive conductive body with which resistance is smoothly reduced by the increase of pressuring force by a method wherein the title conductive composition is composed of an organic polymer material, a semiconductor material having the electric conductivity less than the specific ratio of the conductive material, and an insulating material. CONSTITUTION:The title composition contains an organic polymer material, a conductive material, a semiconductor material having electric conductivity of 1/100 or less of that of the conductive material and an insulating material. As the organic polymer material used, the thermosetting resin such as phenol resin, urea resin, melamine resin, silicon resin, polyurethane resin and the like, and the thermoplastic resin such as vinyl chloride resin, vinylidene chloride resin, polyamide resin and the like are enumerated. Also, silver, nickel, copper and graphite are used as the conductive material. Chrome trioxide and dioxide, titanium dioxide, boron nitride, molybdenum disulfide, magnesium oxide, calcium carbonate, aluminum hydroxide, alumina, zinc flowers, clay, talk and the like are used as the semiconductor material and insulating material. As a result, a conductive composition, withstanding repetition of pressurization and having the characteristics in which its resistance value is smoothly reduced with the increase of pressuring force, can be obtained.