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TI OR TI ALLOY MATERIAL PLATED BY VAPOR DEPOSITION WITH EXCELLENT ADHESION

机译:TI或TI合金材料通过气相沉积和出色的附着力沉积

摘要

PURPOSE: To produce a Ti alloy material plated by vapor deposition with excellent adhesion by forming a vapor-deposited layer of metal Ti having a specified thickness on a Ti alloy material with a Ti oxide layer formed on the surface and forming a ceramic layer on the vapor-deposited layer. ;CONSTITUTION: A vapor-deposited layer of metal Ti contg. no oxide is formed as an underlayer in 0.01-10μm thickness on the surface of a Ti or Ti alloy material with a Ti oxide layer formed on the surface. A ceramic layer or a layer of a metal other than Ti is then formed as the uppermost layer on the underlayer by vapor deposition to obtain the objective Ti or Ti alloy material plated by vapor deposition with excellent adhesion.;COPYRIGHT: (C)1994,JPO
机译:用途:通过在具有以下厚度的Ti合金材料上形成具有指定厚度的金属Ti的汽相沉积层,并在其表面上形成陶瓷层,从而以极好的附着力进行气相沉积镀层的Ti合金材料。气相沉积层。 ;组成:一层金属钛的气相沉积层。在Ti或Ti合金材料的表面上没有形成厚度为0.01-10μm的氧化物作为底层,并且在表面上形成了Ti氧化物层。然后,通过汽相淀积在底层上形成陶瓷层或除钛以外的金属层作为最上层,以获得通过汽相淀积而镀覆的目标Ti或Ti合金材料,并具有优异的粘附性。版权所有:(C)1994,日本特许厅

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