Multilinear package and package board for electron transfer experiments

摘要

The present invention relates to a polyimide wire package and a package board for an electron mobility test, wherein two pads (2) are connected by metal wires (4), and all pads (2) The package board includes a plurality of lead frames 5 formed in one package on one side of the mode 9 and connected to the lead frame 5 through a wire bonding 3, And a power line 7 connected to the lead frame 5 of the package to which the power is not applied so that the power applied to the package flows out.;Therefore, when one board is used to test one package, it is possible to form different current density or temperature condition in the package on each board,;Further, in experimenting the electron transfer using the existing board of the package in which the gold line wiring of the present invention is formed, several kinds of metal wiring lines are patterned in the package, and electrons for different types of metal lines Movement can be measured at the same time.