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plasma processing of iii - v semiconductors, controlled in photolumineszenz spectroscopy.

机译:iii-v半导体的等离子处理,在光致发光的光谱学中得到控制。

摘要

Monitoring wafer changes in situ during plasma treatment provides real-time feedback for developing and controlling device processing. Photoluminescence spectroscopy is described for detecting end point during BCl3 plasma etching of hetero epitaxial films of III-V semiconductors and for monitoring H2 plasma passivation of III-V semiconductor surfaces. When used herein the term plasma processing is intended to include the standard dry processes including processes termed reactive ion processing.
机译:在等离子处理过程中监测晶片的原位变化可提供实时反馈,以开发和控制器件处理。描述了光致发光光谱法,其用于在III-V族半导体的异质外延膜的BCl 3等离子体蚀刻期间检测终点并且用于监视III-V族半导体表面的H 2等离子体钝化。当在本文中使用时,术语等离子体处理旨在包括标准干法处理,包括称为反应性离子处理的处理。

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