A method of three-dimensional assembly of electronic components by means of microfil loops and solder elements.

摘要

According to the invention, for assembling at least one first electronic component (1) provided with at least one first electrical contact pad (5) and at least one second electronic component (10) provided with at least one second contact pad electrical (13), a conductive microfilm loop (7) having at least one end on the first pad is made, a solder element is made on the second pad, the components are positioned so that the loop is facing the welding member, the assembly is heated to melt the solder member (15b) and ensure the attachment of the loop thereon, and the whole is cooled.