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System for the photoelectrochemical etching of silicon in an anhydrous environment

机译:在无水环境中对硅进行光电化学腐蚀的系统

摘要

The photoelectrochemical oxidation and dissolution of silicon (Si) is performed in the absence of water and oxygen. Etch rates and photocurrents in an anhydrous HF-acetonitrile (MeCN) solution are directly proportional to light intensity up to at least 600 mW/cm2, producing a spatially selective etch rate of greater than 4 &mgr;m/min. Four electron transfer reactions per silicon molecule occur with a quantum yield greater than 3.3 due to electron injection from high energy reaction intermediates. Further, the electrochemical oxidation of p-doped silicon in HF-MeCN results in the formation of porous silicon which electroluminescence in an aqueous solution. In an aprotic electrolyte, where tetrabutylammonium tetrafluoroborate (TBAFB) is used as both the supporting electrolyte and source of fluoride in MeCN, photo-induced etching of n-doped silicon occurs at quantum efficiency of 1.9. This indicates that the oxidation and dissolution mechanism of Si in MeCN can occur without protons.
机译:硅(Si)的光电化学氧化和溶解是在没有水和氧气的情况下进行的。无水HF-乙腈(MeCN)溶液中的蚀刻速率和光电流与光强度直接成正比,至少达到600 mW / cm2,产生的空间选择性蚀刻速率大于4μm/ min。由于来自高能反应中间体的电子注入,每个硅分子发生四个电子转移反应,其量子产率大于3.3。此外,在HF-MeCN中p掺杂的硅的电化学氧化导致形成多孔硅,其在水溶液中电致发光。在非质子电解质中,四氟硼酸四丁基铵(TBAFB)同时用作MeCN中的辅助电解质和氟化物源,n掺杂硅的光致刻蚀以1.9的量子效率发生。这表明MeCN中Si的氧化和溶解机理可以在没有质子的情况下发生。

著录项

  • 公开/公告号US5431766A

    专利类型

  • 公开/公告日1995-07-11

    原文格式PDF

  • 申请/专利权人 GEORGIA TECH RESEARCH CORPORATION;

    申请/专利号US19940278658

  • 发明设计人 PAUL A. KOHL;ERIC K. PROPST;

    申请日1994-09-02

  • 分类号C23F1/02;

  • 国家 US

  • 入库时间 2022-08-22 04:04:41

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