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Method of measuring a thickness of a multilayered sample using ultraviolet light and light with wavelengths longer than ultraviolet

机译:使用紫外线和波长比紫外线更长的光测量多层样品厚度的方法

摘要

Spectral reflection ratios with respect to a second wavelength range are obtained and Fourier transformed to derive frequency converted spectrum. A power spectrum is obtained from the frequency converted spectrum to identify a peak which expresses interference caused by a silicon film. An approximate value d2' of the film thickness of the silicon film is calculated based on the peak position. After filtered by low-pass filtering, the frequency converted spectrum is reverse Fourier transformed to obtain spectral reflectance. From the spectral reflectance, theoretical spectral reflection ratios which are theoretically derived on only one transparent film of the thickness d3 which is formed on a silicon layer are subtracted. An approximate value d1' of the thickness of a silicon oxide film is then calculated from the spectral reflectance which are obtained by subtraction.
机译:获得相对于第二波长范围的光谱反射率,并将其进行傅立叶变换以得出频率转换后的光谱。从经频率转换的频谱获得功率频谱,以识别出表示由硅膜引起的干扰的峰。基于峰位置计算硅膜的膜厚度的近似值d2'。在通过低通滤波进行滤波之后,将经频率转换的频谱进行反向傅立叶变换以获得频谱反射率。从光谱反射率中减去理论上仅在形成在硅层上的厚度为d3的一层透明膜上得到的理论光谱反射率。然后根据通过减去获得的光谱反射率来计算氧化硅膜的厚度的近似值d1'。

著录项

  • 公开/公告号US5440141A

    专利类型

  • 公开/公告日1995-08-08

    原文格式PDF

  • 申请/专利权人 DAINIPPON SCREEN MFG. CO. LTD.;

    申请/专利号US19940289320

  • 发明设计人 MASAHIRO HORIE;

    申请日1994-08-11

  • 分类号G01N21/86;G01V9/04;

  • 国家 US

  • 入库时间 2022-08-22 04:04:34

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