SQUARE THIN-FILM CHIP RESISTOR AND ITS ELECTRODE TERMINAL FORMING METHOD

摘要

PURPOSE: To provide a square thin-film chip resistor where no electrode biting occurs on mounting and its electrode terminal forming method by improving the adhesion property between Ni-Cr thin-film electrode and Ni-plated layer which is a barrier layer for preventing the electrode from being bit. ;CONSTITUTION: A square thin-film chip resistor consists of alumina substrate 1, a thin-film upper-surface electrode layer 2 and a thin-film reverse-side electrode layer 3 by a pair of thin-film electrodes formed on the alumina substrate 1, a thin-film resistance layer 4 by Ni-Cr resistor which is formed so that it is connected to the thin-film upper-surface electrode layer 2, a protection coat layer 5 made of thermosetting resin for covering the thin-film resistance layer 4, and a thin-film end-face electrode layer 6 which overlaps with the thin-film upper-surface electrode layer 2 and the thin-film reverse-side electrode layer 3. Then, Ni-plated layer 7 by Ni chloride bath strike plating and Ni-plated layer 8 by Watt bath plating for preventing electrode biting at the time of soldering are formed on an exposed electrode surface.;COPYRIGHT: (C)1996,JPO