REFLOW METHOD, REFLOW FURNACE AND HOT AIR HEATER FOR THE FURNACE

摘要

PURPOSE: To solder an electronic component in response to the condition of a printed board at the time of bringing into contact with hot air by blowing the air from the injection port of a nozzle extended laterally in the advancing direction of the board to the board and suitably altering the width of the port of the nozzle. ;CONSTITUTION: A hot air heater 9 is installed in the heating zone of a reflow furnace. The heater has a nozzle 10 near a conveyor 3; the injection port 11 of the nozzle 10 is extended in the lateral direction in the advancing direction of the board; and the width of the port 11 is variable. When solder paste on a printed board is melted, the heater 9 adjusts the port 11 of the nozzle according to the conditions of the component and the board. That is, if the heating time of the zone is shortened, the port of the nozzle is narrowed to shorten the heating area, or if the time is lengthened, the rotary part of the nozzle is extended to increase the heating area.;COPYRIGHT: (C)1996,JPO