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OFF-AXIS ALIGNING DEVICE FOR SCANNING TYPE PHOTOLITHOGRAPHY AND PHOTOLITHOGRAPHY TOOL

机译:扫描型照相术和照相术的轴外报警装置

摘要

PROBLEM TO BE SOLVED: To improve the alignment precision between a wafer and a mask by providing a sub-system formed of an alignment sensor head, an alignment lighting device and an alignment detecting device. SOLUTION: This device has a lighting source 68, a reticule 32, a first lens device for directing a beam, an aperture stop 38, and a beam splitter 42. It also has second lens devices 48, 50 for directing the beam to a wafer 18 and collecting the beam reflected and scattered by the wafer 18, and the wafer 18 has plus and minus alignment marks thereon. Further, this device has a first detector device related to the beam splitter 42 for detecting the beam reflected by the wafer 18, a detector device for detecting the beam scattered from the plus alignment mark 34' on the wafer 18, and a third detector for detecting the beam scattered from the minus alignment mark 34 on the wafer 18. Thus, a more precise alignment can be attained regardless of number, thickness and layer structure characteristics.
机译:解决的问题:通过提供由对准传感器头,对准照明装置和对准检测装置形成的子系统来提高晶片与掩模之间的对准精度。解决方案:该设备具有光源68,分划板32,用于引导光束的第一透镜设备,孔径光阑38和分束器42。它还具有用于将光束引导至晶片的第二透镜设备48、50。在图18中,晶片18收集并反射由晶片18反射和散射的光束,并且晶片18在其上具有正和负对准标记。此外,该装置具有与用于检测晶片18反射的光束的分束器42有关的第一检测器装置,用于检测从晶片18上的正对准标记34'散射的光束的检测器装置以及用于检测晶片18的第三检测器。检测从晶片18上的负对准标记34散射的光束。因此,无论数量,厚度和层结构特性如何,都可以获得更精确的对准。

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