The hybrid integrated circuit and circuit board - high power

摘要

PURPOSE:To increase the bonding strength with an insulating layer, to alleviate heat shock between a metal board and a copper foil and to prevent the decrease in withstand voltage of the insulating film, by laminating an aluminum foil, the copper foil and an aluminum foil on the insulating layer on the metal board in this order. CONSTITUTION:An aluminum circuit part 2 for stabilizing withstand voltage is laminated as the lowermost layer on a metal board 6 through an insulating layer 5. A thick copper circuit part 1 is laminated on the part 2 as an intermediate layer. An Al bonding post 3 comprising an Al foil is laminated as an uppermost layer. A soldered outer lead terminal part 4 is provided at the local position of the thick copper circuit. Semiconductors, e.g., a power transistor 7 and a diode 8, are mounted with solder 10. The power transistor 7 and the diode 8 are connected to the aluminum bonding post 3, and a circuit is formed.