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Electrolytic surface roughening process manner null of aluminum base material for planographic printing edition

机译:平版印刷版铝基电解表面粗化工艺方法的研究。

摘要

PURPOSE:To obtain a lithographic aluminum substrate hardly staining in a non-printing area and having a high plate wear for a large number of sheets of paper, by a method wherein, a thin layer having a resistance to electrolytic roughening treatment is formed before the electrolytic roughening of an aluminum plate, and then the electrolytic roughening treatment is conducted. CONSTITUTION:A process of forming a thin layer having a resistance to electrolytic roughening on the surface of a cleaned aluminum plate is conducted. As the thin layer, either of an organic film, such as fats and oils, colloidal films and LB film, and an inorganic film, such as oxide films and chemical conversion films, having a relatively high electrically insulating properties can be used. After that, deep pits are generated by an electrolytic roughening treatment. The film is preferably 0.001-0.1g/m2 thick. If less than 0.001g/m2, an effect of forming a deep pit is being reduced. Contrarily, if more than 0.1g/m2, the surface has a larger pit diameter, thus being excessively roughened.
机译:用途:为了获得一种平版印刷铝基板,该铝基板在非印刷区域几乎不沾污并且对于大量纸张具有较高的板磨损,通过一种方法,在该方法之前,先形成具有耐电解粗糙化处理能力的薄层对铝板进行电解粗化,然后进行电解粗化处理。组成:进行了一个过程,在清洁的铝板表面上形成一层具有耐电解粗糙性的薄层。作为薄层,可以使用具有相对高的电绝缘性的有机膜,例如油脂,胶体膜和LB膜,以及无机膜,例如氧化物膜和化学转化膜。之后,通过电解粗糙化处理产生深坑。膜优选为0.001-0.1g / m 2厚。如果小于0.001g / m 2,则形成深坑的效果降低。相反,如果大于0.1g / m 2,则表面的坑直径变大,因此变得过度粗糙。

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