首页> 外国专利> CHIP PROCESSING METHOD IN CUTTING MACHINE AND PRODUCT-EXTRUDING DEVICE DIRECTLY USED IN PRACTICE OF THIS CHIP PROCESSING METHOD

CHIP PROCESSING METHOD IN CUTTING MACHINE AND PRODUCT-EXTRUDING DEVICE DIRECTLY USED IN PRACTICE OF THIS CHIP PROCESSING METHOD

机译:切纸机及产品挤出装置中的切屑加工方法,直接用于这种切屑加工方法的实践中

摘要

PURPOSE: To as far as prevent chips from flowing to a bundle of raw materials by forming a space between a bundle of products and the bundle of raw materials, and jetting a working fluid from the lower stream side in the conveying direction, thereby processing the chips sticking to the bundle of products to fall down into the space. ;CONSTITUTION: A conveying cylinder is driven-controlled by a control means to convey a bundle of raw materials W integrally with a conveying vise backwards. Thus, a next part to be cut in the bundle of raw materials W is located at a cutting position, and a space S having a specified length is formed between the bundle of raw materials W and a bundle of products WA. After the part to be cut in the bundle of raw materials W is located at the cutting position, nozzles 41 are operated-controlled by the control means to inject a working fluid to the bundle of products WA from behind. Thus, chips adhered on the bundle of products WA can be processed to fall down into the space S.;COPYRIGHT: (C)1996,JPO
机译:目的:通过在一捆产品和一捆原材料之间形成一个空间,并沿输送方向从下游侧喷射工作流体,从而尽可能地防止切屑流向一捆原材料。粘在产品捆上的碎屑掉入了空间。 ;组成:输送缸由控制装置驱动控制,以将一捆原料W与输送虎钳一体地向后输送。因此,在原料束W中要切割的下一部分位于切割位置,并且在原料束W和产品束WA之间形成具有指定长度的空间S。在原料束W中的待切割部分位于切割位置之后,通过控制装置对喷嘴41进行操作控制,以将工作流体从后面注入到产品束WA中。因此,粘附在产品捆上的芯片WA可以被处理以掉落到空间S中。;版权所有:(C)1996,JPO

著录项

  • 公开/公告号JPH08108313A

    专利类型

  • 公开/公告日1996-04-30

    原文格式PDF

  • 申请/专利权人 AMADA CO LTD;

    申请/专利号JP19940244018

  • 发明设计人 TOKIWA TORU;

    申请日1994-10-07

  • 分类号B23D55/00;

  • 国家 JP

  • 入库时间 2022-08-22 03:57:59

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