ANALOG/DIGITAL CONVERTING INTEGRATED CIRCUIT CHIP, ANALOG/ DIGITAL CONVERTING PACKAGE CHIP, AND INTEGRATED CIRCUIT PACKAGE CHIP

摘要

PURPOSE: To improve the integration degree of one package chip by packaging a plurality of integrated circuit chips, for example, analog/digital converting integrated circuit chips. ;CONSTITUTION: An integrated circuit part 21 for analog/digital conversion is made on, for example, a quadrangular silicon substrate, and also electrode pads are disposed along the residual three sides excluding one side of a board so as to constitute an analog/digital converting integrated circuit chip 2A. And, this analog/digital converting integrated circuit chip 2A and an analog/digital converting integrated circuit chip 28 are joined to each other at one side each with no row of electrode pads and are accommodated in a package symmetrically about the junction, and then the electrode pad and the terminal 53 are connected with each other by a bonding wire so as to constitute an analog/ digital converting package chip 5.;COPYRIGHT: (C)1995,JPO