THERMAL CONDUCTION ELEMENT AND HEAT-DISSIPATING STRUCTURE USING IT

摘要

PURPOSE: To provide a thin information processing apparatus in which a crack is not generated in a soldered part, on a board on which an IC or the like is mounted, in which there is no danger if a low-temperature burn when the apparatus is carried and which is excellent in a heat-dissipating effect. ;CONSTITUTION: A thermal conduction element is formed in such a way that a rubberlike elastic body part is brought into contact with at least one face of a support member 2. Then, in the heat-dissipating structure of heat generated from a heat generation source for a thin information processing apparatus, the thermal conduction element in which the thermal conductivity of the support member 2 is at 10010^-3 (cal/cm.sec.C) or higher, in which the thermal conductivity of the rubberlike elastic body part 3 is at 1 to 510^-3 (cal/cm.sec.C) and whose penetration is 10 to 80 (mm10) and one rubberlike elastic body part 3 of the thermal conduction element are brought into contact with the top face of the heat generation source, and the other is brought into close contact with a metal chassis on the rear side of an input-operation recessed-part arrangement panel for the information processing apparatus.;COPYRIGHT: (C)1996,JPO