首页> 外国专利> THERMALLY CONDUCTIVE COMPOSITE FILLER, HEAT-DISSIPATING RESIN COMPOSITION CONTAINING SAME, AND HEAT-DISSIPATING GREASE AND HEAT-DISSIPATING MEMBER COMPRISING HEAT-DISSIPATING RESIN COMPOSITION

THERMALLY CONDUCTIVE COMPOSITE FILLER, HEAT-DISSIPATING RESIN COMPOSITION CONTAINING SAME, AND HEAT-DISSIPATING GREASE AND HEAT-DISSIPATING MEMBER COMPRISING HEAT-DISSIPATING RESIN COMPOSITION

机译:导热复合填料,包含相同成分的散热树脂成分以及包含散热树脂成分的散热脂和散热成员

摘要

[Problem] To improve thermally conductive fillers. [Solution] A binder-containing thermally conductive composite filler containing a first thermally conductive filler, a second thermally conductive filler, and an oxazoline compound. Typically the first thermally conductive filler is aluminum nitride and the second thermally conductive filler is boron nitride. A resin composition that uses the thermally conductive composite filler. A heat-dissipating member that uses the resin composition.
机译:[问题]改善导热填料。 [解决方案]含粘合剂的导热复合填料,其包含第一导热填料,第二导热填料和恶唑啉化合物。通常,第一导热填料是氮化铝,而第二导热填料是氮化硼。使用导热复合填料的树脂组合物。使用该树脂组合物的散热构件。

著录项

  • 公开/公告号WO2019189182A1

    专利类型

  • 公开/公告日2019-10-03

    原文格式PDF

  • 申请/专利权人 JNC CORPORATION;

    申请/专利号WO2019JP12853

  • 发明设计人 FUJIWARA TAKESHI;KOGA SHIN;UJIIYE KENTO;

    申请日2019-03-26

  • 分类号C08L101/12;C08K3/01;C08L29/14;C09K5/14;H01L23/373;

  • 国家 WO

  • 入库时间 2022-08-21 11:52:57

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