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process for the catalytic treatment of a substrate in the plating strömfri

机译:镀层str u00f6mfri中对基材进行催化处理的方法

摘要

There is disclosed a novel process for catalyzation for trapping of a catalyst metal involved with the adhesion of an electroless plating to a substrate. The process is carried out by employing neither the sensitizing-activating method nor the catalyst-accelerator method. Specifically, in forming an electroless plating on the surface of a non-conductive substance as a substrate, the surface of the non-conductive substance is coated with a treatment liquid containing at least chitosan or a chitosan derivative before the steps of catalyzation and electroless plating to form a hydrophilic coating film on the surface of the non-conductive substance.
机译:公开了一种新颖的催化方法,用于捕获与化学镀层对基底的粘附有关的催化剂金属。该方法既不采用增敏活化法也不采用催化剂促进剂法进行。具体地,在非导电物质作为衬底的表面上形成化学镀时,在催化和化学镀步骤之前,用至少包含壳聚糖或壳聚糖衍生物的处理液涂覆该非导电物质的表面。在非导电物质的表面上形成亲水性涂膜。

著录项

  • 公开/公告号SE9500571L

    专利类型

  • 公开/公告日1996-06-09

    原文格式PDF

  • 申请/专利权人 DAISHIN KAGAKU KK;OMURA TORYO KK;

    申请/专利号SE19950000571

  • 发明设计人 OMURA YOSHIHIKO;

    申请日1995-02-16

  • 分类号C23C18/18;

  • 国家 SE

  • 入库时间 2022-08-22 03:52:24

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