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Electroless Plating of Palladium Membranes on Porous Substrates for Hydrogen Separation and the Effects of Process Factors on Plating Rate and Efficiency: A Review

机译：钯膜对多孔基材的化学镀氢分离及工艺因子对电镀率和效率的影响：综述

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Abubakar Alkali;
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年度 2020
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1. Electroless Plating of Palladium Membranes on Porous Substrates for Hydrogen Separation and the Effects of Process Factors on Plating Rate and Efficiency: A Review [J] . Abubakar Alkali Journal of Power and Energy Engineering . 2020,第2期

机译：钯膜对多孔基材的化学镀氢分离及过程因子对电镀率和效率的影响：综述
2. Electroless Plating of Palladium Membranes on Porous Substrates for Hydrogen Separation and the Effects of Process Factors on Plating Rate and Efficiency: A Review [J] . Abubakar Alkali 电力能源（英文） . 2020,第002期

机译：氢分离多孔基材上钯膜的化学镀及工艺因素对镀覆速率和效率的影响
3. Effects of Sn residue on the high temperature stability of the H2-permeable palladium membranes prepared by electroless plating on Al2O3 substrate after SnCl2-PdCl2 process: A case study [J] . Lei Wei, Jian Yu, Xiaojuan Hu, 中国化学工程学报（英文版） . 2016,第009期

机译：残留锡对SnCl2-PdCl2处理后在Al2O3衬底上化学镀的H2渗透性钯膜高温稳定性的影响：案例研究
4. Effects of ultrasonic process on the adhesion of Cuon-conductive PCB substrate in electroless copper plating [C] . Ju-Suk Kang, Jinuk Lee, Hyun-Woo Kwon, International Conference on Electronics Packaging . 2017

机译：超声处理对化学镀铜中Cu /非导电PCB基板附着力的影响
5. Thermal Stability of Pd-Ag Composite Membranes Fabricated by Surfactant Induced Electroless Plating (SIEP) Method for Hydrogen Separation. [D] . Tun, Hla. 2015

机译：表面活性剂化学镀（SIEP）制氢分离Pd-Ag复合膜的热稳定性。
6. Review of Supported Pd-Based Membranes Preparation by Electroless Plating for Ultra-Pure Hydrogen Production [O] . David Alique, David Martinez-Diaz, Raul Sanz, 2018

机译：化学镀超纯氢生产负载型钯基膜的研究进展
7. 1 High Pressure Hydrogen Permeance of Porous Stainless Steel Coated with a Thin Palladium Film via Electroless Plating [O] . Kurt S. Rothenberger, Anthony V. Cugini, Bret H. Howard, 2010

机译：1通过化学镀法涂覆薄钯膜的多孔不锈钢的高压氢气渗透性

Electroless Plating of Palladium Membranes on Porous Substrates for Hydrogen Separation and the Effects of Process Factors on Plating Rate and Efficiency: A Review

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