首页> 外国专利> Rosin-free, low voc, no-clean soldering flux and method using the same

Rosin-free, low voc, no-clean soldering flux and method using the same

机译:无松香,低摩擦,免清洗助焊剂及其使用方法

摘要

A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8% by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an aggregate amount not exceeding about 10% by weight of the flux; and water, with or without a surfactant. The flux is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary.
机译:无松香,低VOC,免清洗助焊剂主要由一种或多种无卤化物的羧酸活化剂组成,总量不超过助焊剂重量的8%;一种或多种能够形成一种或多种活化剂的胺盐的烷基胺,其总量不超过焊剂重量的约10%;和水,有或没有表面活性剂。助焊剂在生产具有最小残留离子污染的焊接印刷线路组件的方法中特别有用,因此不需要对组件进行焊后清洗。

著录项

  • 公开/公告号AU3508695A

    专利类型

  • 公开/公告日1996-03-27

    原文格式PDF

  • 申请/专利权人 FRYS METALS INC.;

    申请/专利号AU19950035086

  • 申请日1995-09-07

  • 分类号B23K35/362;H05K3/22;

  • 国家 AU

  • 入库时间 2022-08-22 03:49:54

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