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PROCEDURE AND APPARATUS FOR IMPROVING A PLASMA ACCELERATOR PLATING APPARATUS USED FOR DIAMOND PLATING

机译:用于改进用于金刚石镀覆的等离子体加速器镀覆装置的程序和设备

摘要

method and improved apparatus for electroplating used for deposition of diamond films, which leads to the formation of a first arc between a first electrode (1) and an ignition element (5) connected to it, and a second with the aid of the first arc, between the the first electrode (1) and a second electrode (3).a plasma arc power supply, with the first electrode (1) is directed towards the material (7) to be covered.the surface (10) of the first electrode which is released on the feed material is abraded continuously in the process of electrodeposition through a fitting in which the emitting surface and at least one abrasive element (11 ', 5') are placed in contact with it. displaced in relation to one another.
机译:于沉积金刚石膜的电镀方法和改进的电镀设备,其导致在第一电极(1)和与其连接的点火元件(5)之间形成第一电弧,并借助第一电弧形成第二电弧在第一电极(1)和第二电极(3)之间,等离子弧电源与第一电极(1)对准要覆盖的材料(7)。第一电极的表面(10)在电沉积过程中,通过配件连续研磨释放在进料上的电极,在该配件中,发射面和至少一个磨料(11',5')与之接触。彼此之间流离失所。

著录项

  • 公开/公告号EP0620867B1

    专利类型

  • 公开/公告日1996-03-20

    原文格式PDF

  • 申请/专利权人 SITRA FOUNDATION;

    申请/专利号EP19930900217

  • 发明设计人 KOSKINEN JARI;ANTTILA ASKO;

    申请日1992-12-30

  • 分类号C23C14/22;C23C14/32;C23C14/06;H01J37/32;H05H1/50;

  • 国家 EP

  • 入库时间 2022-08-22 03:47:36

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