(Ti, Al) N plasma chemical vapor deposition method

摘要

The present invention relates to a method of depositing a (Ti, Al) N film using a plasma chemical vapor deposition process. (Ti, Al) N film is a new tool coating material which is made by adding Al element to existing TiN. And a technique of coating the material at a low temperature of around 500C by using a plasma chemical vapor deposition method which can be applied to a tool of mass production and a complicated shape.;TiCl₄, AlCl₃, N₂, H₂(Ar) N thin films were deposited using R.F. plasma at a reaction temperature of 400 to 500C and a deposition pressure of 0.5 to 5 Torr. The deposited (Ti, Al) N film showed a large increase in hardness of more than 2800 / at Al content of about 10% and showed excellent resistance to oxidation even in the air heat treatment up to 700C.